DALL-E Continuous Package-Level Scaling Moore’s Law, which predicted the doubling of transistors every two years, is slowing down due to atomic-scale limitations. The industry is adapting by shifting towards advanced packaging solutions that enable continued performance scaling without the need for extreme lithography advancements, such as EUV (extreme ultraviolet) lithography or multi-patterning techniques. These new methodologies are not just a shift, but a leap forward in semiconductor technology. They facilitate enhanced chip density, lower power consumption, and higher performance across various applications. Some of the key package-level scaling approaches include: This evolution in packaging enhances system-level performance, optimizes power efficiency, and provides superior thermal management, which is critical for AI workloads, high-performance computing, and next-generation consumer electronics. Packaging Cost And Economic Feasibility While advanced packaging drives performance […]