#chetanpatil – Chetan Arvind Patil

Published On: January 2022

The Growing Focus On Semiconductor Fabrication

Photo by Vishnu Mohanan on Unsplash Since the semiconductor shortage started, private semiconductor players and public bodies have focused on semiconductor manufacturing. The primary reason impact semiconductor shortage had on all other industries that heavily rely on semiconductor solutions. One of the positive impacts of semiconductor shortage (which ideally should be called a semiconductor opportunity) is the conversation around how to mitigate such shortage scenarios in the future. The best approach is increasing the semiconductor manufacturing capacity, but it also comes with several resources and investment constraints. Private: Focusing on market-driven technology requirements and upgrading/building semiconductor fabrication capacity. Public: Focused on creating an ecosystem for private players to either expand existing in-country semiconductor fabrication networks or create a new one from scratch. It is more valid for semiconductor fabrication. It takes two […]

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The Emerging Semiconductor Devices

Photo by Chris Ried on Unsplash The shrinking size of semiconductor nodes has led to better performance, which is beneficial from a features point of view, but not from the cost point of view. The cost to design and manufacture highly complex chips (to provide better performance) is increasing year on year. It is thus pushing the semiconductor industry towards solutions that enable new features but are also not high (long term) on cost. To balance the cost with features, semiconductor researchers (academia and industry) have focused on solutions that are not high on investment and at the same time provide a way towards the More-Then-Moore era. The one approach that researchers have taken is to focus on the silicon devices and then invent improved versions that provide balanced (power,

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The Building Blocks Of Semiconductor Driven Heterogeneous Integration

Photo by Nenad Grujic on Unsplash Heterogeneous Integration (HI) has become one of the most focused topics in the last decade. From academia to industry, everyone is publishing and launching innovative solutions to scale transistors per area out of the die. HI is also one of the paths (that soon) all of the semiconductors companies will have to follow for high-impact and core systems like XPUs. For every new technology, there are basic blocks that are required to ensure the new technology is adopted speedily. The list of blocks can be endless and varies from technology to technology. The same is valid for new semiconductor technology, and the challenges become tenfold due to the time, cost, and resources required to make an idea work error-free. HI also requires several new

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The Impact Of Testing In Semiconductor Manufacturing

Photo by ShareGrid on Unsplash Semiconductor testing is one of the most critical steps in ensuring that the product meets all the required specifications and quality standards. Thus semiconductor testing has also become a major driving factor for defect-free products. Every chip manufactured has to go through testing processes to ensure the data collected is in line with the expected range. This step ensures the product shipped is fault-free. It requires understanding the product’s internal architecture (by non-designers) before creating testing rules to validate every block within the design. Compliance: Semiconductor product testing plays a vital role in ensuring the product manufactured meets the compliance targets as per the specification and thus requires testing for the worst to best technical scenarios. Accuracy: Semiconductor manufacturing needs to be accurate, and any deviation can

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The Horizontal And Vertical Semiconductor Integration

Photo by Denys Nevozhai on Unsplash Advanced semiconductor package technologies have always played a crucial role in transistor scaling. It is also the primary reason these two scaling methods complement each other to enable customers (and industry) with innovative solutions. Die and package level innovation have always provided the industry with solutions (chiplets, heterogeneous integration, big.LITTLE, etc.) that took the semiconductor design and manufacturing to a new level. Today, this synchronized work of die level-scaling with package innovation has taken the semiconductor industry towards a sub-1nm technology node. Historically, the semiconductor industry has always focused on transistor scaling from two points of view: Die: Shrinking the devices while not compromising on the power delivery. Package: Package level scaling (SiP as an example) solution is used to tackle transistor scaling bottlenecks. Similar to

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