#chetanpatil – Chetan Arvind Patil

Published On: March 2022

The Semiconductor Over Capacity Risk

Photo by Taylor Hammersla on Unsplash Semiconductor capacity has been the most talked-about topic due to the semiconductor shortage. Companies and countries are upgrading or building semiconductor manufacturing to cater to ever-increasing demand. However, simply increasing the semiconductor capacity is not the answer and often comes with several techniques to business challenges. The technical challenge involves deciding on the technology-node and package technology to focus on, which is not an easy decision and requires an end-to-end view of how the market will evolve and which technology will be crucial. Yield and throughput also play a role. On top of all this, the technology (lithography as an example) equipment required should work as expected. More so when the new capacity focuses on advanced semiconductor solutions. Capacity: Building new semiconductor manufacturing capacity is not always […]

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The Semiconductor Hurdles For Inspection

Photo by L N on Unsplash Semiconductor products often fail, and finding the root cause thus becomes a critical process. More so, when the product is already in production. Failure and root cause analysis are vital steps towards finding issues with the semiconductor product. Doing so requires an inspection process that allows engineers to look inside the chip. Several advanced equipment and technologies (SEM and beyond) can provide an in-depth view of what is happening inside the chip. The hurdles thus are not the availability of technology required to drive failure analysis. The real challenge is the complexity (silicon level) that the advanced design and manufacturing brings to enable failure analysis. Complexity: Growing transistor count increases the die level complexity, which brings difficulties to perform failure analysis without investing more than

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The Cross Collaboration And Standardization Across Semiconductor Industry

Photo by Nick Fewings on Unsplash There are several parts to semiconductor product development, and without cross-industry collaboration and standardization, it is impossible to move forward (next-gen solutions). Collaboration and standardization have triggered several innovative solutions that have only taken the semiconductor industry forward. These strategic approaches come in different forms. Some are between two or more semiconductor-focused companies, many driven by consortiums of several companies (semiconductor and non-semiconductor). Irrespective of the approach, the focus is to bring new semiconductor technologies. Collaboration Benefits: It fosters the environment where one or more companies can share the knowledge to enable next-gen devices that can create future markets while expanding the current one. Examples of such collaboration are many. Collaboration between XPU developers and non-XPU developers is one. The reason one relies on

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The Growing Reliance Of Semiconductor Industry On Software

Photo by ThisisEngineering RAEng on Unsplash Software is the backbone of several industries, including semiconductor. Several (maybe all) semiconductor activities cannot work without a software solution and are valid for several key stages like design, manufacturing, supply chain, and many more. This growing reliance on several stages is the primary reason it has become vital to utilize the best solution for all the stages of semiconductor product development. Doing so enables defect-free and error-free solutions for the end customers. The advancement in software tools has allowed the semiconductor industry to lower the time to market. As more advanced semiconductor technologies get deployed, the importance of developing faster and more accurate software will grow further and increase the reliance of the semiconductor industry on software solutions. Automation: Automated software solutions plays a

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