#chetanpatil – Chetan Arvind Patil

Published On: June 2022

The Growing Influence Of Semiconductor Package On Scaling

Photo by Christopher Bill on Unsplash Advancements in package technology are as vital as advancements in technology nodes. These two semiconductor solutions enable silicon products to work per the required specifications. Technology node innovation has occurred more rapidly than package technology. Given that now the technology node is going to hit the node wall, it is time for package technology to provide avenues to shape the future of next-gen silicon design and manufacturing. The semiconductor package has always been an integral part of semiconductor manufacturing. It has shaped and powered different silicon features and cost-optimized solutions for several decades. Semiconductor package technologies also ensure that the end-product can withstand harsh operating conditions by managing different thermal, chemical, physical and mechanical characteristics. Features: Package level scaling creates silicon area for new […]

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The Importance Of Capturing Semiconductor Data

Photo by Anne NygÃ¥rd on Unsplash Data has become a vital commodity in today’s market. The same is valid for the semiconductor industry. More so when the cost to capture the semiconductor data is rising. The semiconductor data capturing is directly tied to the process level solution that demands high-cost LAB and FAB to enable data collection to make accurate decisions. Rock’s Law (Moore’s Second Law) states that the cost of building a semiconductor manufacturing facility doubles every four years. However, in the last few years (market dynamics), Rock’s Law is not only changing in terms of cost but also time. Today, the cost doubles every two years (or even less). It is primarily due to the faster advancement in the technological solution that is creating the need for next-gen

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The Semiconductor Race To Scale Technology

Photo by Jeremy Thomas on Unsplash The technology roadmap for the semiconductor device level scaling is updated yearly. However, implementation demands several years of continuous effort. It is also why only a few semiconductor manufacturing firms can follow the technology scaling roadmap accurately. For semiconductor design and manufacturing companies to stay ahead of the scaling curve demands years of planning. It ranges from a specific node to scale, the solution to focus on, new types of devices and working with the equipment industry to support next-gen solutions. On top of all this, whether there is a market that demands building new technology node capacity. Resources: Scaling technology demands many capital-intensive design and manufacturing resources. Execution: Utilizing resources to drive perfect execution is key to enabling next-gen scaling solutions. Planning such

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The Semiconductor Learning From The Capacity Crisis

Photo by Liam Briese on Unsplash In the last two years, the semiconductor manufacturing capacity has seen all the ups and downs it could have. From rising silicon demand to overflowing orders to capacity crunch to building new futurist capacity, all of these in a short period. In the end, the semiconductor manufacturing enterprises could fulfill orders based but not without long cycle times. The overflowing orders without the ability to cater to all requests in the standard cycle time have been a steep learning curve for semiconductor companies and semiconductor-dependent industries. This learning ranges from finding the weakest link to empowering better forecasts via data and planning. Weakest: Finding the weakest link in the semiconductor chain and making it the strongest one is vital for future growth. Forecast: Robust

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