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Published On: July 2022

The Already Advanced Semiconductor Manufacturing

Leave a Comment / ADVANCED, BLOG, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY /

Photo by Robert V. Ruggiero on Unsplash Advanced manufacturing is one of the most important development and is pushing manufacturing (across industries) towards a new era. Several criteria decide whether a given manufacturing industry stands to call itself an advanced one. These criteria (not set) have been around for a while, and the manufacturing world is embracing the changes to enable advanced features to provide quality products to the market. What Is Advanced: Solutions Deployed In Manufacturing Environment That Improves Productivity, Quality, And Time-To-Market But Still Requires Human Guidance. There are four information points to identify the advanced manufacturing industry. These are Data, Equipment, Process, And Automation. Together, these four attributes provide a clear view of advanced manufacturing. When it comes to the semiconductor industry, these four feature points are already […]

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The Growing Need To Adopt Multi-Technology Semiconductor Fabrication

Leave a Comment / BLOG, FAB, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY /

Photo by Henry & Co. on Unsplash The semiconductor fabrication process is complex and costly, and it takes a lot of time to fabricate advanced solutions. Apart from the technical and business hurdles, the ability to develop one specific type of semiconductor device node is not resource-friendly. It also drives the demand to continuously invest in new facilities, which may or may not be ROI friendly. Multi-Technology Semiconductor Fabrication: Either Two Existing In-Demand Technology Can Be Fabricated At The Same Facility Or At Least Allow The Ability To Quickly Re-Spin The Existing Facility To A New One. This problem is getting more expensive with the launch of advanced technology nodes that require a new type of process flow, material, and equipment, which in turn requires a dedicated new facility. It

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The Need To Integrate Semiconductor Die And Package Roadmap

Leave a Comment / BLOG, MANUFACTURING, ROADMAP, SEMICONDUCTOR, TECHNOLOGY /

Photo by Vishnu Mohanan on Unsplash Several semiconductor industry-wide roadmaps are planned and released by semiconductor companies and also different technical semiconductor groups. These semiconductor roadmaps are vital in providing glimpses of future semiconductor technologies and how they will shape silicon products. Out of all the semiconductor roadmaps, the two most critical are the die roadmap and the package roadmap. These two roadmaps are drafted by separate technological groups apart from different roadmaps from semiconductor companies. There is no question that these roadmaps provide a way to design and manufacture next-gen silicon products to transform industries relying on semiconductors. Package: Roadmap at package-level focus on providing next-gen integration solutions. Die: Die level roadmap focuses purely on the devices to enable next-gen nodes. However, today, the semiconductor industry is at the cross-section where

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The Long-Term Impact Of Semiconductor Chiplets

Leave a Comment / BLOG, CHIPLET, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY /

Photo by Louis Reed on Unsplash Chiplets are changing the way complex products like XPUs getting designed and manufactured. Its impact is how modular the new XPU solutions are becoming. This modularity is paving the way for new-age IP-driven XPU design and manufacturing and opening up features that were not easy to deploy due to the need for the aggregated approach. As with any new semiconductor process and technology, the vital factor is the long-term impact of such new solutions. In the case of chiplets, it has already started to impact design and manufacturing methods. The positive long-term impact of chiplets is providing the ability for XPU developers to enable solutions in the angstrom era by leveraging the disaggregated approach. It is also opening up a new design approach that

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The Ever Increasing Cost Of Semiconductor Design And Manufacturing

Leave a Comment / BLOG, COST, MANUFACTURING, SEMICONDUCTOR, TECHNOLOGY /

Photo by Anne Nygård on Unsplash The complexity of semiconductor devices is increasing at a rapid pace. The reason is the demand for new features, which requires novel design and manufacturing approaches, which come at a higher cost due to the time, resources, and investment needed to enable new semiconductor solutions. On the design side, it has become easier to bring up new solutions and prove them using an advanced simulation approach. Eventually, these solutions should be fabricated and validated, which costs millions of dollars, and with every next-gen design and manufacturing process, the cost of prove-in keeps increasing. Design: Complex solutions demand time and resources, which increases the cost of new solutions. Manufacturing: Bringing new solutions to the market means investing in new-age manufacturing facilities. The connected (equipment, material, raw wafers,

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