Published On: September 24, 2023

Photo by Laura Ockel on Unsplash Chiplet is undoubtedly the most suitable semiconductor design and manufacturing solution to scale complex chips reaching the reticle limit. Several silicon products have already adopted chiplet, mainly processors. These products have showcased that using multiple chiplet can significantly improve performance. All while not worrying about the reticle or device constraints. Several initiatives have come up to speed up the adoption rate of chiplet. Like, Universal Chiplet Interconnect Express (UCIe), which is an open specification for bridging different types of chiplets from the same or multiple vendors by standardizing the interconnectivity, quality, reliability, and several other aspects that are critical to a chip build using the disaggregated approach. Similarly, a few more industry and academia consortiums have emerged, focusing on several criteria to ramp up […]