Published On: October 1, 2023

Adobe Firefly Semiconductor packaging is one of the last steps in semiconductor manufacturing and a crucial one. Protecting the silicon die from physical, mechanical, and thermal damage is only possible with a packaging solution. Silicon package technologies are also vital in developing interfaces that enable new architectures, like chiplet based XPUs. Historically, ever since the first silicon, there have been efforts to accommodate new types of package technologies by adapting the requirements of the end application. It has been in line with Moore’s law. Lately, one such adoption is embracing the advanced packaging technique. It is a needed solution that enables the path towards the More-Than-Moore era. So, what does advanced packaging mean? In simple terms, advanced semiconductor packaging refers to assembly techniques developed to provide technical […]