Published On: February 8, 2025

DALL-E Semiconductor Defect Pattern Analysis The relentless drive for higher performance, lower power consumption, and increased functionality in semiconductor devices has led to unprecedented complexity in semiconductor manufacturing processes. As technology nodes shrink below 3nm and the adoption of 3D structures, such as GAAFETs, becomes widespread, the variability introduced by intricate process steps, material interactions, and equipment behavior poses significant challenges. Traditional yield analysis methods, which primarily rely on statistical summaries and post-mortem evaluations, are no longer sufficient to address these complexities. In this evolving landscape, defect pattern analysis has emerged as a methodology for identifying, understanding, and mitigating yield-limiting mechanisms at both macro and micro scales. Defect pattern analysis systematically identifies and characterizes recurring defect trends across wafers, lots, and production lines. Unlike random defects, which […]