#chetanpatil – Chetan Arvind Patil
Photo by Denys Nevozhai on Unsplash Advanced semiconductor package technologies have always played a crucial role in transistor scaling. It is also the primary reason these two scaling methods complement each other to enable customers (and industry) with innovative solutions. Die and package level innovation have always provided the industry
Hi, I am Chetan Arvind Patil (chay-tun – how to pronounce), a semiconductor professional whose job is turning data into products for the semiconductor industry that powers billions of devices around the world. And while I like what I do, I also enjoy biking, working on few ideas, apart from writing, and talking about interesting developments in hardware, software, semiconductor and technology.
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