#chetanpatil – Chetan Arvind Patil
Photo by Henry & Co. on Unsplash The semiconductor fabrication process is complex and costly, and it takes a lot of time to fabricate advanced solutions. Apart from the technical and business hurdles, the ability to develop one specific type of semiconductor device node is not resource-friendly. It also drives
Photo by Vishnu Mohanan on Unsplash Several semiconductor industry-wide roadmaps are planned and released by semiconductor companies and also different technical semiconductor groups. These semiconductor roadmaps are vital in providing glimpses of future semiconductor technologies and how they will shape silicon products. Out of all the semiconductor roadmaps, the two
Photo by Louis Reed on Unsplash Chiplets are changing the way complex products like XPUs getting designed and manufactured. Its impact is how modular the new XPU solutions are becoming. This modularity is paving the way for new-age IP-driven XPU design and manufacturing and opening up features that were not
Photo by Anne Nygård on Unsplash The complexity of semiconductor devices is increasing at a rapid pace. The reason is the demand for new features, which requires novel design and manufacturing approaches, which come at a higher cost due to the time, resources, and investment needed to enable new semiconductor
Photo by Christopher Bill on Unsplash Advancements in package technology are as vital as advancements in technology nodes. These two semiconductor solutions enable silicon products to work per the required specifications. Technology node innovation has occurred more rapidly than package technology. Given that now the technology node is going to
Photo by Anne Nygård on Unsplash Data has become a vital commodity in today’s market. The same is valid for the semiconductor industry. More so when the cost to capture the semiconductor data is rising. The semiconductor data capturing is directly tied to the process level solution that demands high-cost
Photo by Jeremy Thomas on Unsplash The technology roadmap for the semiconductor device level scaling is updated yearly. However, implementation demands several years of continuous effort. It is also why only a few semiconductor manufacturing firms can follow the technology scaling roadmap accurately. For semiconductor design and manufacturing companies to
Photo by Liam Briese on Unsplash In the last two years, the semiconductor manufacturing capacity has seen all the ups and downs it could have. From rising silicon demand to overflowing orders to capacity crunch to building new futurist capacity, all of these in a short period. In the end,
Photo by Laura Ockel on Unsplash More than 50% of the semiconductor FAB (fabrication) cost is due to equipment and tools. Any given FAB has hundred different types of these, and without the required tools and equipment, the FAB cannot work efficiently. One piece of equipment that drives the semiconductor
Photo by Lukas on Unsplash Processors are an integral part of any computing device. For the last few years, the importance of providing efficient and high-performance processors has only grown over the decade. It has thus shifted the design and manufacturing aspect of processing units, thus enabling the transition towards
Hi, I am Chetan Arvind Patil (chay-tun – how to pronounce), a semiconductor professional whose job is turning data into products for the semiconductor industry that powers billions of devices around the world. And while I like what I do, I also enjoy biking, working on few ideas, apart from writing, and talking about interesting developments in hardware, software, semiconductor and technology.
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Adobe Firefly The realm of artificial intelligence (AI) is experiencing a transformative shift, primarily driven by innovative AI chips
Adobe Firefly Semiconductor test engineering is a specialized domain within the semiconductor industry that ensures integrated circuits (ICs) function
Adobe Firefly Semiconductor wafer processing is an intricate series of steps to produce integrated circuits on silicon wafers. Artificial
Adobe Firefly Semiconductor packaging is one of the last steps in semiconductor manufacturing and a crucial one. Protecting the
Photo by Laura Ockel on Unsplash Chiplet is undoubtedly the most suitable semiconductor design and manufacturing solution to scale complex
