#chetanpatil – Chetan Arvind Patil
Adobe Firefly Semiconductor packaging is one of the last steps in semiconductor manufacturing and a crucial one. Protecting the silicon die from physical, mechanical, and thermal damage is only possible with a packaging solution. Silicon package technologies are also vital in developing interfaces that enable new architectures,
Photo by Christopher Bill on Unsplash Advancements in package technology are as vital as advancements in technology nodes. These two semiconductor solutions enable silicon products to work per the required specifications. Technology node innovation has occurred more rapidly than package technology. Given that now the technology node is going to
Photo by Ryan on Unsplash THE MOVE TOWARDS THE NEXT-GEN SEMICONDUCTOR PACKAGE TECHNOLOGY Packaging plays an important role in almost all the industry. From cars to rovers, packaging the product before shipping is vital. Doing so cost-effectively is critical to ensure the product cost is not affected. The same story
Hi, I am Chetan Arvind Patil (chay-tun – how to pronounce), a semiconductor professional whose job is turning data into products for the semiconductor industry that powers billions of devices around the world. And while I like what I do, I also enjoy biking, working on few ideas, apart from writing, and talking about interesting developments in hardware, software, semiconductor and technology.
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