#chetanpatil – Chetan Arvind Patil

Category: TECHNOLOGY

The Semiconductor Lithography Race: NIL VS EUV

Adobe Firefly In semiconductor manufacturing, lithography is a pivotal process. It involves transferring circuit patterns onto a silicon wafer, a foundational step in creating integrated circuits (ICs). Two of the most advanced lithography techniques currently at the forefront of this industry are Extreme Ultraviolet (EUV) and Nanoimprint

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The AI World Beyond Semiconductor GPUs

Adobe Firefly Graphics Processor Units (GPUs) have become the default go-to architecture whenever the requirement is for faster throughput. The primary reason is the massively parallel processing with the help of many cores and how the memories get organized around them. Due to the benefits of such

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The Ever-Growing Need For Semiconductor Yield Management

Adobe Firefly What Is Semiconductor Yield Management: The manufacturing of semiconductor devices is a highly intricate process that involves multiple steps. Even minor deviations in these steps can result in defects that render the device non-functional. Semiconductor yield management is a process that aims to identify and

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The Semiconductor AISoC Platform Alliance

Adobe Firefly The realm of artificial intelligence (AI) is experiencing a transformative shift, primarily driven by innovative AI chips developed by startups. These enterprises are challenging the status quo, bringing cutting-edge chip architectures tailored to optimize deep learning, neural networks, and other AI tasks. By pushing the

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How Artificial Intelligence Helps With Semiconductor Wafer Processing

Adobe Firefly Semiconductor wafer processing is an intricate series of steps to produce integrated circuits on silicon wafers. Artificial Intelligence (AI) has proven to be a powerful tool in refining and enhancing these processes. AI offers a range of applications in semiconductor wafer processing. Leveraging AI technologies

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Why The Semiconductor Industry Is Speedily Adopting Advanced Packaging

Adobe Firefly Semiconductor packaging is one of the last steps in semiconductor manufacturing and a crucial one. Protecting the silicon die from physical, mechanical, and thermal damage is only possible with a packaging solution. Silicon package technologies are also vital in developing interfaces that enable new architectures,

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The Hurdles In Adopting Chiplets As Semiconductor More-Than-Moore Solution

Photo by Laura Ockel on Unsplash Chiplet is undoubtedly the most suitable semiconductor design and manufacturing solution to scale complex chips reaching the reticle limit. Several silicon products have already adopted chiplet, mainly processors. These products have showcased that using multiple chiplet can significantly improve performance. All while not worrying

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Chetan Arvind Patil

Chetan Arvind Patil

                Hi, I am Chetan Arvind Patil (chay-tun – how to pronounce), a semiconductor professional whose job is turning data into products for the semiconductor industry that powers billions of devices around the world. And while I like what I do, I also enjoy biking, working on few ideas, apart from writing, and talking about interesting developments in hardware, software, semiconductor and technology.

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Opinions expressed here are my own and may not reflect those of others. Unless I am quoting someone, they are just my own views.

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